MMIC MIS CHIP CAPACITORS
|
MIS CHIP CAPACITORS |
|||||
|
Tolerance = +/- 10 % on singles; Binary = +/- 20%. |
|||||
|
Metallization options: |
|||||
|
"A" = AuSn Attach and wire bondable pad |
|||||
|
"B" = Au/Ge attach (backside) and |
|||||
|
Singles (A) |
AuSn topsidefor
FET or MMIC Mounting (self bias) |
||||
|
Part Number |
Capacitance |
Standoff Voltage |
RFQ |
||
|
(pF) |
(V) |
||||
|
MP0001 |
1.0 |
100 |
|||
|
MP0002 |
2.0 |
100 |
|||
|
MP0003 |
3.0 |
100 |
|||
|
MP0004 |
4.0 |
100 |
|||
|
MP0005 |
5.0 |
100 |
|||
|
MP0010 |
10.0 |
100 |
|||
|
MP0015 |
15.0 |
100 |
|||
|
MP0022 |
22.0 |
50 |
|||
|
MP0033 |
33.0 |
50 |
|||
|
MP0047 |
47.0 |
50 |
|||
|
MP0068 |
68.0 |
50 |
|||
|
MP0100 |
100.0 |
50 |
|||
Binary (A)
|
||||
|
Part
Number |
Capacitance |
Total Capacitance |
Standoff Voltage |
RFQ |
|
(pF) |
(pF) |
(V) |
||
|
MP0402 |
0.25, 0.50, 1.0,
2.0 |
3.75 |
100 |
|
|
MP0404 |
0.5, 1.0, 2.0, 4.0 |
7.5 |
100 |
|
|
MP0408 |
1.0, 2.0, 4.0, 8.0 |
15 |
100 |
|
|
MP0416 |
2.0, 4.0, 8.0, 16.0 |
30 |
100 |
|
|
MMIC MIS CHIP CAPACITORS |
|||||
|
Tolerance = +/- 10 % on singles; Binary = +/- 20%. |
|||||
|
Metallization options: |
|||||
|
"B" = Eutectic attach (backside) and AuSn topside for FET or MMIC Mounting
(self bias) |
|||||
|
MMIC/FET Mounting
(B) |
|||||
|
Part Number |
Capacitance (min) |
Standoff Voltage |
Top pad area |
Overall Dimensions |
RFQ |
|
(pF) |
(V) |
||||
|
MP0125 |
125 |
50 |
72x72 |
75x75 |
|
|
MP0150 |
150 |
50 |
108x108 |
110x110 |
|
|
MP0500 |
500 |
50 |
163x163 |
165x165 |
|